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PCA9549
Octal bus switch with individually I2C-bus controlled enables
Rev. 01 -- 11 July 2006 Product data sheet
1. General description
The PCA9549 provides eight bits of high speed TTL-compatible bus switching controlled by the I2C-bus. The low ON-state resistance of the switch allows connections to be made with minimal propagation delay. Any individual A to B channel or combination of channels can be selected via the I2C-bus, determined by the contents of the programmable Control register. When the I2C-bus bit is HIGH (logic 1), the switch is on and data can flow from Port A to Port B, or vice versa. When the I2C-bus bit is LOW (logic 0), the switch is open, creating a high-impedance state between the two ports, which stops the data flow. An active LOW reset input (RESET) allows the PCA9549 to recover from a situation where the I2C-bus is stuck in a LOW state. Pulling the RESET pin LOW resets the I2C-bus state machine and causes all the bits to be open, as does the internal power-on reset function. Three address pins allow up to eight devices on the same bus.
2. Features
I I I I I I I I I I I I I I I 8-bit bus switch (CBT) 5 switch connection between two ports I2C-bus interface logic; compatible with SMBus standards Active LOW RESET input 3 address pins allowing up to 8 devices on the I2C-bus Bit selection via I2C-bus, in any combination Power-up with all bits deselected Low Ron switches No glitch on power-up Supports hot insertion Low standby current Operating power supply voltage range of 2.3 V to 5.5 V 5 V tolerant inputs 0 Hz to 400 kHz clock frequency ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115 and 1000 V CDM per JESD22-C101 I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA I Packages offered: SO24, TSSOP24, HVQFN24
Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
3. Ordering information
Table 1. Ordering information Package Name PCA9549D PCA9549PW PCA9549BS SO24 TSSOP24 HVQFN24 Description plastic small outline package; 24 leads; body width 7.5 mm plastic thin shrink small outline package; 24 leads; body width 4.4 mm plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm Version SOT137-1 SOT355-1 SOT616-1 Type number
3.1 Ordering options
Table 2. PCA9549D PCA9549PW PCA9549BS Ordering options Topside mark PCA9549D PCA9549 9549 Temperature range -40 C to +85 C -40 C to +85 C -40 C to +85 C Type number
4. Block diagram
PCA9549
1A 2A 3A 4A 5A 6A 7A 8A 1B 2B 3B 4B 5B 6B 7B 8B
VSS VDD RESET
SWITCH CONTROL LOGIC
RESET CIRCUIT
SCL SDA
INPUT FILTER
I2C-BUS CONTROL
A0 A1 A2
002aaa991
Fig 1. Block diagram
PCA9549_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 11 July 2006
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Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
5. Pinning information
5.1 Pinning
A0 A1 RESET 1A 1B 2A 2B 3A 3B
1 2 3 4 5 6 7 8 9
24 VDD 23 SDA 22 SCL 21 A2 20 8A 19 8B 18 7A 17 7B 16 6A 15 6B 14 5A 13 5B
002aaa992
A0 A1 RESET 1A 1B 2A 2B 3A 3B
1 2 3 4 5 6 7 8 9
24 VDD 23 SDA 22 SCL 21 A2 20 8A 19 8B 18 7A 17 7B 16 6A 15 6B 14 5A 13 5B
002aaa993
PCA9549D
PCA9549PW
4A 10 4B 11 VSS 12
4A 10 4B 11 VSS 12
Fig 2. Pin configuration of SO24
24 RESET
Fig 3. Pin configuration of TSSOP24
20 SDA
23 A1
1A 1B 2A 2B 3A 3B
1 2 3 4 5 6 5B 10 5A 11 6B 12 7 8 9
22 A0
terminal 1 index area
19 SCL 18 A2 17 8A 16 8B 15 7A 14 7B 13 6A
002aaa994
PCA9549BS
4A
4B
Transparent top view
Fig 4. Pin configuration of HVQFN24 (transparent top view)
PCA9549_1
VSS
21 VDD
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Product data sheet
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Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
5.2 Pin description
Table 3. Symbol A0 A1 RESET 1A 1B 2A 2B 3A 3B 4A 4B VSS 5B 5A 6B 6A 7B 7A 8B 8A A2 SCL SDA VDD
[1]
Pin description Pin SO, TSSOP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 HVQFN 22 23 24 1 2 3 4 5 6 7 8 9[1] 10 11 12 13 14 15 16 17 18 19 20 21 address input 0 address input 1 active LOW reset input input output input output input output input output supply ground output input output input output input output input address input 2 serial clock line serial data line supply voltage Description
HVQFN package die supply ground is connected to both the VSS pin and the exposed center pad. The VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board-level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias need to be incorporated in the PCB in the thermal pad region.
PCA9549_1
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Product data sheet
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Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
6. Functional description
6.1 Device addressing
Following a START condition, the bus master must output the address of the slave it is accessing. The address of the PCA9549 is shown in Figure 5. To conserve power, no internal pull-up resistors are incorporated on the hardware selectable address pins and they must be pulled HIGH or LOW.
1
1
1
0
A2
A1
A0 R/W
fixed
hardware selectable
002aaa962
Fig 5. Slave address
The last bit of the slave address defines the operation to be performed. When set to logic 1 a read is selected, while a logic 0 selects a write operation.
6.2 Control register
Following the successful acknowledgement of the slave address, the bus master will send a byte to the PCA9549, which will be stored in the Control register. If multiple bytes are received by the PCA9549, it will save the last byte received. This register can be written and read via the I2C-bus.
channel selection bits (read/write) 7 B7 6 B6 5 B5 4 B4 3 B3 2 B2 1 B1 0 B0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 bit 8
002aab254
Fig 6. Control register
6.2.1 Control register definition
One or several bits are selected by the contents of the Control register. This register is written after the PCA9549 has been addressed. The entire control byte is used to determine which bit is to be selected. When a bit is selected to close, the bit will close after the Acknowledge has been placed on the I2C-bus.
PCA9549_1
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Product data sheet
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Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
Table 4. Control register Write = channel selection; read = channel status. B7 X X X X X X X 0 1
[1]
B6 X X X X X X 0 1 X
B5 X X X X X 0 1 X X
B4 X X X X 0 1 X X X
B3 X X X 0 1 X X X X
B2 X X 0 1 X X X X X
B1 X 0 1 X X X X X X
B0 0 1 X X X X X X X
Command bit 1 disabled bit 1 enabled bit 2 disabled bit 2 enabled bit 3 disabled bit 3 enabled bit 4 disabled bit 4 enabled bit 5 disabled bit 5 enabled bit 6 disabled bit 6 enabled bit 7 disabled bit 7 enabled bit 8 disabled bit 8 enabled
Several bits can be enabled at the same time. For example, B7 = 0, B6 = 1, B5 = 0, B4 = 0, B3 = 1, B2 = 1, B1 = 0, B0 = 0, means that bit 8, bit 6, bit 5, bit 2, and bit 1 are disabled and bit 7, bit 4, and bit 3 are enabled.
6.3 RESET input
The RESET input is an active LOW signal which may be used to recover from a bus fault condition. By asserting this signal LOW for a minimum of tw(rst)L, the PCA9549 will reset its registers and I2C-bus state machine and will open all bits. The RESET input must be connected to VDD through a pull-up resistor.
6.4 Power-on reset
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9549 in a reset state until VDD has reached VPOR. At this point, the reset condition is released and the PCA9549 registers and I2C-bus state machine are initialized to their default states, all zeroes causing all the bits to be open (high-impedance state).
6.5 CBT characteristic over VDD range
The bus switch is optimized at 5.0 V but can operate over the entire supply range with lower Vo(sw) voltage and higher gate resistance.
PCA9549_1
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Product data sheet
Rev. 01 -- 11 July 2006
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Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
5.0 Vo(sw) (V) 4.0
(1)
002aaa964
3.0
(2) (3)
2.0
1.0 2.0
2.5
3.0
3.5
4.0
4.5
5.5 5.0 VDD (V)
(1) maximum (2) typical (3) minimum
Fig 7. Vo(sw) voltage versus VDD
Figure 7 shows the voltage characteristics of the pass gate transistors (note that the PCA9549 is only tested at the points specified in Section 9 "Static characteristics"). In order for the PCA9549 to act as a voltage translator, the Vo(sw) voltage should be equal to, or lower than the lowest bus voltage. For example, if the main bus was running at 5 V, and the downstream buses were 3.3 V and 2.7 V, then Vo(sw) should be equal to or below 2.7 V to effectively clamp the downstream bus voltages. Looking at Figure 7, we see that Vo(sw) (maximum) will be at 2.7 V when the PCA9549 supply voltage is 3.5 V or lower so the PCA9549 supply voltage could be set to 3.3 V. Pull-up resistors can then be used to bring the bus voltages to their appropriate levels (see Figure 16).
PCA9549_1
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Product data sheet
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Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
7. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor. Data transfer may be initiated only when the bus is not busy.
7.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Figure 8).
SDA
SCL data line stable; data valid change of data allowed
mba607
Fig 8. Bit transfer
7.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P) (see Figure 9).
SDA
SDA
SCL S START condition P STOP condition
SCL
mba608
Fig 9. Definition of START and STOP conditions
7.2 System configuration
A device generating a message is a `transmitter'; a device receiving is the `receiver'. The device that controls the message is the `master' and the devices which are controlled by the master are the `slaves' (see Figure 10).
PCA9549_1
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Product data sheet
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Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
SDA SCL MASTER TRANSMITTER/ RECEIVER SLAVE RECEIVER SLAVE TRANSMITTER/ RECEIVER MASTER TRANSMITTER MASTER TRANSMITTER/ RECEIVER I2C-BUS MULTIPLEXER
SLAVE
002aaa966
Fig 10. System configuration
7.3 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter, whereas the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse; set-up and hold times must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event, the transmitter must leave the data line HIGH to enable the master to generate a STOP condition.
data output by transmitter not acknowledge data output by receiver acknowledge SCL from master S START condition 1 2 8 clock pulse for acknowledgement
002aaa987
9
Fig 11. Acknowledgement on the I2C-bus
PCA9549_1
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Product data sheet
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Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
7.4 Bus transactions
Data is transmitted to the PCA9549 control register using the Write mode as shown in Figure 12.
slave address SDA S 1 1 1 0 A2 A1 A0 0 A B7 B6
control register B5 B4 B3 B2 B1 B0 A P
START condition
R/W
acknowledge from slave
acknowledge from slave STOP condition
002aac430
Fig 12. Write control register
Data is read from the PCA9549 using the Read mode as shown in Figure 13.
slave address SDA S 1 1 1 0 A2 A1 A0 1 A B7 B6
control register B5 B4 B3 B2 B1
last byte
B0
A
P
START condition
R/W
acknowledge from slave
no acknowledge from master STOP condition
002aac431
Fig 13. Read control register
8. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol VDD VI II IO IDD ISS Ptot Tstg Tamb
[1]
Parameter supply voltage input voltage input current output current supply current ground supply current total power dissipation storage temperature ambient temperature
Conditions
Min -0.5 -0.5 -20 -25 -100 -100 -60
Max +7.0 +7.0 +20 +25 +100 +100 400 +150 +85
Unit V V mA mA mA mA mW C C
operating
-40
The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 125 C.
PCA9549_1
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Product data sheet
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Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
9. Static characteristics
Table 6. Static characteristics VDD = 2.3 V to 3.6 V; VSS = 0 V; Tamb = -40 C to +85 C; unless otherwise specified. See Table 7 on page 12 for VDD = 4.5 V to 5.5 V[1]. Symbol Supply VDD IDD Istb VPOR VIL VIH IOL IL Ci VIL VIH ILI Ci Pass gate Ron ON-state resistance VDD = 3.0 V to 3.6 V; VO = 0.4 V; IO = 15 mA VDD = 2.3 V to 2.7 V; VO = 0.4 V; IO = 10 mA Vo(sw) switch output voltage Vi(sw) = VDD = 3.3 V; Io(sw) = -100 A Vi(sw) = VDD = 3.0 V to 3.6 V; Io(sw) = -100 A Vi(sw) = VDD = 2.5 V; Io(sw) = -100 A Vi(sw) = VDD = 2.3 V to 2.7 V; Io(sw) = -100 A IL Cio
[1] [2]
Parameter supply voltage supply current standby current power-on reset voltage LOW-level input voltage HIGH-level input voltage LOW-level output current leakage current input capacitance LOW-level input voltage HIGH-level input voltage input leakage current input capacitance
Conditions
Min 2.3
Typ 20 0.1 1.6 6 2 7 8 1.9 1.5 3
Max 3.6 50 1 2.1 +0.3VDD 6 +1 21 +0.3VDD VDD + 0.5 +1 5 12 15 2.8 2.0 +1 5
Unit V A A V V V mA mA A pF V V A pF V V V V A pF
Operating mode; VDD = 3.6 V; no load; VI = VDD or VSS; fSCL = 100 kHz Standby mode; VDD = 3.6 V; no load; VI = VDD or VSS no load; VI = VDD or VSS
[2]
-0.5 0.7VDD
Input SCL; input/output SDA
VOL = 0.4 V VOL = 0.6 V VI = VDD or VSS VI = VSS
3 6 -1 -0.5 0.7VDD
Select inputs A0 to A2, RESET
pin at VDD or VSS VI = VSS
-1 1.6 1.0 -1 -
leakage current input/output capacitance
VI = VDD or VSS VI = VSS
For operation between published voltage ranges, refer to the worst-case parameters in both ranges. VDD must be lowered to 0.2 V in order to reset part.
PCA9549_1
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Product data sheet
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Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
Table 7. Static characteristics VDD = 4.5 V to 5.5 V; VSS = 0 V; Tamb = -40 C to +85 C; unless otherwise specified. See Table 6 on page 11 for VDD = 2.3 V to 3.6 V[1]. Symbol Supply VDD IDD supply voltage supply current Operating mode; VDD = 5.5 V; no load; VI = VDD or VSS; fSCL = 100 kHz Standby mode; VDD = 5.5 V; no load; VI = VDD or VSS no load; VI = VDD or VSS
[2]
Parameter
Conditions
Min 4.5 -
Typ 65
Max 5.5 100
Unit V A
Istb VPOR VIL VIH IOL IIL IIH Ci VIL VIH ILI Ci Pass gate Ron Vo(sw)
standby current power-on reset voltage LOW-level input voltage HIGH-level input voltage LOW-level output current LOW-level input current HIGH-level input current input capacitance LOW-level input voltage HIGH-level input voltage input leakage current input capacitance ON-state resistance switch output voltage
-0.5 0.7VDD
0.6 1.7 6 2 5 3.6 3
2 2.1 +0.3VDD 6 1 1 21 +0.3VDD VDD + 0.5 +50 5 8 4.5 +10 5
A V V V mA mA A A pF V V A pF V V A pF
Input SCL; input/output SDA
VOL = 0.4 V VOL = 0.6 V VI = VSS VI = VSS VI = VSS
3 6 1 1 -0.5 0.7VDD
Select inputs A[0:2]/RESET
pin at VDD or VSS VI = VSS VDD = 4.5 V to 5.5 V; VO = 0.4 V; IO = 15 mA Vi(sw) = VDD = 5.0 V; Io(sw) = -100 A Vi(sw) = VDD = 4.5 V to 5.5 V; Io(sw) = -100 A
-1 2.6 -10 -
IL Cio
[1] [2]
leakage current input/output capacitance
VI = VDD or VSS VI = VSS
For operation between published voltage ranges, refer to the worst-case parameters in both ranges. VDD must be lowered to 0.2 V in order to reset part.
PCA9549_1
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Product data sheet
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Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
10. Dynamic characteristics
Table 8. Symbol Dynamic characteristics Parameter Conditions Standard-mode I2C-bus Min tPD fSCL tBUF tHD;STA tLOW tHIGH tSU;STA tSU;STO tHD;DAT tSU;DAT tr tf Cb tSP tVD;DAT tVD;ACK RESET tw(rst)L trst tREC;STA
[1] [2] [3] [4]
Fast-mode I2C-bus Unit Min 0 1.3 0.6 1.3 0.6 0.6 0.6 0[3] 100 Max 0.25[1] 400 0.9 ns kHz s s s s s s s ns ns s s ns s s s ns ns ns
Max 0.25[1] 100 3.45 1000 300 400 50 1 0.6 1 -
propagation delay SCL clock frequency bus free time between a STOP and START condition hold time (repeated) START condition LOW period of the SCL clock HIGH period of the SCL clock set-up time for a repeated START condition set-up time for STOP condition data hold time data set-up time rise time of both SDA and SCL signals fall time of both SDA and SCL signals capacitive load for each bus line pulse width of spikes that must be suppressed by the input filter data valid time data valid acknowledge time LOW-level reset time reset time recovery time to START condition
A to B; VDD = 4.5 V to 5.5 V
0 4.7
[2]
4.0 4.7 4.0 4.7 4.0 0[3] 250 -
20 + 0.1Cb[4] 300 20 + 0.1Cb[4] 300 4 500 0 400 50 1 0.6 1 -
HIGH-to-LOW LOW-to-HIGH
4
SDA clear
500 0
Pass gate propagation delay is calculated from the 6 typical Ron and the 50 pF load capacitance. After this period, the first clock pulse is generated. A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIH(min) of the SCL signal) in order to bridge the undefined region of the falling edge of SCL. Cb = total capacitance of one bus line in pF.
PCA9549_1
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Product data sheet
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Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
SDA tBUF tLOW SCL tr tf tHD;STA tSP
tHD;STA P S tHD;DAT tHIGH tSU;DAT Sr
tSU;STA
tSU;STO P
002aaa986
Fig 14. Definition of timing on the I2C-bus
START SCL
ACK or read cycle
SDA
70 %
trst
RESET
50 % trec(rst)
50 % tw(rst)L
50 %
002aac314
Fig 15. Definition of RESET timing
PCA9549_1
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Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
11. Application information
VDD = 5.0 V
VDD = 5.0 V
I2C-bus/SMBus MASTER SDA SCL SDA SCL RESET 1A 1B bit 1
2A 2B
bit 2
3A 3B
bit 3
PCA9549
4A 4B bit 4
5A 5B
bit 5
6A 6B
bit 6
7A A2 A1 A0 VSS 8A 8B 7B
bit 7
bit 8
002aaa995
Remark: B can also be input and A can also be output as shown in bit 8.
Fig 16. Typical application
A
B
C
D
E
SCL SDA RESET
A
B
C
D
E
002aac279
Fig 17. Custom multiplexer or demultiplexer application
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Product data sheet
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Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
AA AB AC AD
BA BB BC BD
SCL SDA RESET
A
B
002aac280
Fig 18. 2 channel 4-to-1 multiplexer or demultiplexer
12. Test information
2VDD VDD PULSE GENERATOR
RT RL
VO DUT
CL 50 pF
002aac315
CL = load capacitance includes jig and probe capacitance RL = load resistance RT = termination resistance; should be equal to Zo of pulse generator
Fig 19. Test circuit
PCA9549_1
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PCA9549
Octal bus switch with individually I2C-bus controlled enables
13. Package outline
SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 A1 pin 1 index Lp L 1 e bp 12 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)
0.9 0.4
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
0.035 0.004 0.016
8 o 0
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 20. SO24 package outline (SOT137-1)
PCA9549_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
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Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
D
E
A
X
c y HE vMA
Z
24
13
Q A2 pin 1 index A1 (A 3) A
Lp L
1
e bp
12
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 7.9 7.7 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.5 0.2 8o 0o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19
Fig 21. TSSOP24 package outline (SOT355-1)
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Product data sheet
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Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm
SOT616-1
D
B
A
terminal 1 index area A A1 E c
detail X
e1
1/2 e
C b 12 vMCAB wMC 13 e y1 C y
e 7 L 6
Eh
1/2 e
e2
1
18
terminal 1 index area
24 Dh 0
19 X 2.5 scale 5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 4.1 3.9 Dh 2.25 1.95 E (1) 4.1 3.9 Eh 2.25 1.95 e 0.5 e1 2.5 e2 2.5 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT616-1 REFERENCES IEC --JEDEC MO-220 JEITA --EUROPEAN PROJECTION ISSUE DATE 01-08-08 02-10-22
Fig 22. HVQFN24 package outline (SOT616-1)
PCA9549_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 11 July 2006
19 of 24
Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
14. Soldering
14.1 Introduction to soldering surface mount packages
There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow temperatures range from 215 C to 260 C depending on solder paste material. The peak top-surface temperature of the packages should be kept below:
Table 9. SnPb eutectic process - package peak reflow temperatures (from J-STD-020C July 2004) Volume mm3 < 350 240 C + 0/-5 C 225 C + 0/-5 C Volume mm3 350 225 C + 0/-5 C 225 C + 0/-5 C
Package thickness < 2.5 mm 2.5 mm Table 10.
Pb-free process - package peak reflow temperatures (from J-STD-020C July 2004) Volume mm3 < 350 260 C + 0 C 260 C + 0 C 250 C + 0 C Volume mm3 350 to 2000 260 C + 0 C 250 C + 0 C 245 C + 0 C Volume mm3 > 2000 260 C + 0 C 245 C + 0 C 245 C + 0 C
Package thickness < 1.6 mm 1.6 mm to 2.5 mm 2.5 mm
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
PCA9549_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 11 July 2006
20 of 24
Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 C and 320 C.
14.5 Package related soldering information
Table 11. Package[1] BGA, HTSSON..T[3], LBGA, LFBGA, SQFP, SSOP..T[3], TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC[5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L[8],
[1] [2]
Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable not suitable[4] Reflow[2] suitable suitable
suitable not not WQCCN..L[8] recommended[5][6] recommended[7]
suitable suitable suitable not suitable
PMFP[9],
not suitable
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.
PCA9549_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 11 July 2006
21 of 24
Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[4]
[5] [6] [7] [8]
[9]
15. Abbreviations
Table 12. Acronym CBT CDM DUT ESD HBM I2C MM PCB SMBus TTL Abbreviations Description Cross Bar Technology Charged Device Model Device Under Test ElectroStatic Discharge Human Body Model Inter Integrated Circuit Machine Model Printed-Circuit Board System Management Bus Transistor-Transistor Logic
16. Revision history
Table 13. Revision history Release date 20060711 Data sheet status Product data sheet Change notice Supersedes Document ID PCA9549_1
PCA9549_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 11 July 2006
22 of 24
Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
17. Legal information
17.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com.
17.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
17.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a Philips Semiconductors product can reasonably be expected
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus -- logo is a trademark of Koninklijke Philips Electronics N.V.
18. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
PCA9549_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 11 July 2006
23 of 24
Philips Semiconductors
PCA9549
Octal bus switch with individually I2C-bus controlled enables
19. Contents
1 2 3 3.1 4 5 5.1 5.2 6 6.1 6.2 6.2.1 6.3 6.4 6.5 7 7.1 7.1.1 7.2 7.3 7.4 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 17.1 17.2 17.3 17.4 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Device addressing . . . . . . . . . . . . . . . . . . . . . . 5 Control register . . . . . . . . . . . . . . . . . . . . . . . . . 5 Control register definition . . . . . . . . . . . . . . . . . 5 RESET input . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 6 CBT characteristic over VDD range . . . . . . . . . . 6 Characteristics of the I2C-bus. . . . . . . . . . . . . . 8 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 START and STOP conditions . . . . . . . . . . . . . . 8 System configuration . . . . . . . . . . . . . . . . . . . . 8 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10 Static characteristics. . . . . . . . . . . . . . . . . . . . 11 Dynamic characteristics . . . . . . . . . . . . . . . . . 13 Application information. . . . . . . . . . . . . . . . . . 15 Test information . . . . . . . . . . . . . . . . . . . . . . . . 16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 20 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 20 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 21 Package related soldering information . . . . . . 21 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22 Legal information. . . . . . . . . . . . . . . . . . . . . . . 23 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 23 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Contact information. . . . . . . . . . . . . . . . . . . . . 23 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. Date of release: 11 July 2006 Document identifier: PCA9549_1

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